? by semikron 15.07.99 skiip 692 gal 170 - 276 ctv absolute maximum ratin g s symbol conditions 1) values units v isol 4) ac, 1min 4000 v t op ,t stg operating / stor. temperature -25...+85 c igbt and diode v ces 1700 v v cc 5) operating dc link voltage 1200 v i c igbt a t j 3) igbt + diode -40...+150 c i f diode a i fm diode, t p < 1 ms a i fsm diode, t j = 150 c, 10ms; sin a i 2 t (diode) diode, t j = 150 c, 10ms 508 kas 2 driver v s1 stabilized power s upply 18 v v s2 non-stabilized power supply 30 v f smax switching frequency 10,0 khz dv/dt primary to secondary side 75 kv/s characteristics symbol conditions 1) min. typ. max. units igbt v (br)ces driver without supply 3 v ces -- v i ces v ge = 0, t j = 25 c v ce = v ces t j = 125 c - - 2 70 - - ma ma v to t j = 125 c - 1,77 - v r t t j = 125 c - 6,9 - m w v cesat i c = 600a, t j = 125 c - 5,9 - v v cesat i c = 600a, t j = 25 c - 3,85 - v e on + e off v cc =900/1200v, i c =600a t j = 125 c - 507/781 - mj c chc per phase , ac side - 1 , 6 - nf l ce top, bottom - 7,5 - nh fwd diode 2) v f = v ec i f = 600a; t j = 125 c - 1,59 - v v f = v ec i f = 600a; t j = 25 c -- 2,80 v e on + e off i f = 600a; t j = 125 c - 72 - mj v to t j = 125 c - 0,90 - v r t t j = 125 c - 1,2 - m w thermal characteristics r thjs 10) per igbt -- 0,038 c/w r thjs 10) per diode -- 0,054 c/w r thsa 6,10) p16 heatsink; see case s2 -- 0,044 c/w driver i s1 supply current 15v-supply 250+530*f s /f smax +1,3*i ac /a ma i s2 supply current 24v-supply 210+370*f s /f smax +1,0*i ac /a ma t interlock-driver interlock-time -s skiippack protection i tripsc short circuit protection 750 2% a i triplg ground fault protection - a t trip over-temp. protection 115 5% c u dctrip 9) u dc -protection 1225 2% v mechanical data m1 dc terminals, si units 4 - 6nm m2 ac terminals, si units 8 - 10 nm skiippack a a a a sk integrated intelligent power pack boost converter skiip 692 gal 170 - 276 ctv 7,9) preliminary data case s2 features short circuit protection, due to evaluation of current sensor signals isolated power supply low thermal impedance optimal thermal management with integrated heatsink pressure contact technology with increased power cycling capab ility, compact design low stray inductance high power, small losses over-temperature protection 1) t heatsink = 25 c, unless otherwise specified 2) cal = controlled axial lifetime technology (soft and fast) 3) without driver 4) driver input to power input/ power output to heatsink 5) with semikron-dc link (low inductance) 6) other heatsinks on request 7) c - integrated current sensors t - temperature protection v - 15 v or 24 v power supply 8) ac connection busbars must be connected by the user; copper busbars available on request 9) options available for driver: u - dc link voltage sense f C fiber optic connector 10) s referenced to temperature sensor
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